Rigid PCB
Layers count: 1-24
Min Line width/spacing(mil): 2.0/2.0
Max Aspect Ratio: 12:1
Board thickness(mil): 6 - 200
Max Panel size: 22.5″* 42.5″
Material: FR-4,High Tg FR-4, Halogen free, High Frequency
(Rogers, Arlon, Taconic, Nelco, etc.)
Surface Treatment: HASL, ENIG, ENEPIG, Immersion Silver, Immersion Tin, Flash Gold, Golden Finger, OSP, Lead free HASL, etc.

Rigid-Flex Board
Mass production capacity for high density rigid-flex board fabrication
Max layers count: 16
Min Line width/spacing for inner layer(mil): 2/2
Max Aspect Ratio: 12:1
Min Hole size(mil): 6
Impedance control
HDI

Metal Clad Circuits
Layer count: 1-4L (metal substrate & metal clad board), 1-2L ceramic board
Board thickness: 0.5-7.0 mm; Size: max. 610*610 mm
Thermal conductivity： 1-4W/mk for normal metal material, and 24-170W/mk for ceramic material
Surface finish: HAL, ENIG, ENEPIG, Immertion Tin, Immertion Silver, OSP, etc.