Quick Turn with Express Delivery

Samples: 12 hours for single sided, 24 hours for double sided, and 2-7 days for multilayer
Mass production: 7-10 days for normal conventional boards, 12-15 days for high layer and HDI

Conventional PCBs

Conventional PCBs can be any layer count but rely on conventional drilling and plating technology.
Multilayer up to 24 layers                                                                              Panel thickness up to 0.45"
Wide range of laminate options including high temperature,                 RF and microwave circuits
low loss and lead-free laminates                                                                 Heavy copper (10 oz outer layer / 5 oz inner layer
Mixed dielectric (hybrid) constructions                                                        Panel size up to 30" * 55"
Embedded coin, or metal core and metal backed MLB                           Embedded, distributed and discrete passive components

HDI (High Density Interconnect PCBs)

HDI PCBs capitalize on the latest technologies available to increase the functionality of PCBs using the same or less amount of area. This advancement in PCB technology is driven by the miniaturization of components and semiconductor packages that supports advanced features in revolutionary new products such as touch screen computing and 5G network communications.

HDI PCBs are characterized by high density attributes including laser micro vias, fine lines and high performance thin materials. This increased density enables more functions per unit area. Higher technology HDI PCBs have multiple layers of copper filled stacked micro vias (advanced HDI PCBs) which creates a structure that enables even more complex interconnections. These very complex structures provide the necessary routing solutions for today's large pin count chips utilized in mobile devices and other high technology products.

HDI Structures:
1+N+1 - PCBs contain 1 "build-up" of high density interconnection layers;
i+N+i (i≥2) - PCBs contain 2 or more "build-up" of high density interconnection layers. Micro vias on different layers can be staggered or stacked. Copper filled stacked micro via structures are commonly seen in demanding designs.
Any layer HDI - All the layers of a PCB are high density interconnection layers which allows the conductors on any layer of the PCB to be interconnected freely with copper filled stacked micro via structures. This provides a reliable interconnect solution for highly complex large pin-count devices, such as CPU and GPU chips utilized on handheld and mobile devices.

Advanced Capabilities:

Any layer HDI
Multi layer copper filled stacked micro via structure
2/2 mil line/space
4/10 mil laser via capture pad size
Embedded distributed and discrete passive components
Complex rigid-flex HDI products
Wide material and surface finish selections